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Grounding, Bonding and Power Quality

May 7, 2015 @ 8:00 am - May 7, 2017 @ 5:00 pm

Grounding, Bonding and Power Quality

National Electrical Code Article 250 can be one of the most confusing parts of the NEC.  This class teaches you the fundamentals of the grounding and bonding requirements based on the National Electrical for electrical power systems.  Learn about the grounding electrode system, equipment grounding, bonding jumpers and more.  Understand why substations have ground grids to minimize touch and step potential.  See what the requirements are for separately derived systems and how incorrect grounding can lead to ground loops which can create hazardous conditions.  Many power quality issues can be traced to incorrect grounding.  IEEE Standard 1100 defines requirements for grounding and bonding sensitive electronic equipment.  Power Quality is a broad term used to describe the health of a power system’s voltage and current. Spikes, sags, surges, noise and other events can disrupt the operation of critical systems. Many power quality problems can be attributed to improper or incorrect grounding.

In this, Jim shows you the correct grounding and bonding requirements to minimize or reduce power quality problems as well as how to identify and solve common power quality problems.

Jim has developed this course based on over 30 years of extensive experience in conducting numerous power quality studies for industrial, commercial and utility power systems.

What You Will Receive

• Training manuals of 5 modules containing almost 500 pages
• Jim’s short circuit calculation worksheets
• Harmonic analysis and design worksheets
• Access to Technical articles
• Many calculation examples and problems
• 32 hours of Continuing Education Credit

Have This Class On-Site at Your Location

You can also have this class conducted on-site at your location.  Contact our Program Director at 800.874.8883 to see about having Jim teach this class to your staff at your company’s facilities.  Contact us for your custom on-site training proposal.

GROUNDING, BONDING AND POWER QUALITY – INTRODUCTION

SENSITIVE ELECTRONIC EQUIPMENT GROUNDING

  • IEEE Std. 1100 Recommended Practice for Powering and Grounding Electronic Equipment
  • Signal Reference Subsystem
  • Equipontential Grounding
  • Separation of Loads, Lighting/Surge Grounding
    Isolated Ground Design, Shielded Transformers

BASIC CONCEPTS AND DEFINITIONS

  • Effective Ground Fault Current Path
  • Equipment Grounding Conductor
  • Separately Derived System
  • Ground Fault Circuit Interrupter
  • Grounding Electrode and Grounding
  • Electrode Conductor

GROUNDING ELECTRODE CONDUCTOR

  • NEC Table 250.66
  • Sizing the Grounding Electrode Conductor
  • Supplemental Electrode Requirements
  • Exceptions to NEC Table 250.66
  • Grounding Multiple Overhead Services
  • Example Problems

GROUNDING AND BONDING REQUIREMENTS

  • Electrical System Grounding
  • Grounding of Electrical Equipment
  • Bonding of Electrical Equipment
  • Bonding of Electrically Conductive Material
  • Effective Ground Fault Current Path
  • Ungrounded System Grounding and
  • Bonding Requirements

EQUIPMENT GROUNDING AND BONDING

  • Purpose of Equipment Grounding
  • NEC Table 250.122
  • Conductor Selection vs. Overcurrent Device Size
  • Conduit as the Equipment Ground

BONDING JUMPER

  • NEC Table 250.102(C)(1)
  • Main Bonding Jumper
  • System Bonding Jumper
  • Supply Side Bonding Jumper
  • Correlation Between Bonding Jumper and
  • Fault Current

GROUNDING ELECTRODE SYSTEM

  • Ground Rod, Metal Water Pipe, Building Steel
  • Concrete Encased Electrode, Ground Ring
  • Electrolytic Ground, Ground Resistance Requirements

GROUNDING AND ELECTRICAL SAFETY

  • Shock and Electrocution Current
  • Physiological Response to Electric Current
  • Importance of Grounding and Electrical Safety
 

POWER QUALITY ANALYSIS

  • Definition of Power Quality, Wave Characteristics
  • Sags/Swells, Grounding and Objectionable Current
  • Noise, EMI, Ground Loops

SEPARATELY DERIVED SYSTEMS

  • Service Entrance, Transformers, UPS, Generators and 3 pole vs. 4 pole transfer switches and Ground Loops,
  • Serving Two or More Buildings from One Source

GROUNDING TO EARTH

  • Ground Resistance, Soil Resistivity, Ground Resistance Measurements, Grounding and Corrosion
  • Ground Grids, Touch and Step Potential

TELECOMMUNICATION GROUNDING AND BONDING

  • Telecom Main Grounding Bus bar (TMGB)
  • Telecom Bonding Backbone (TBB)
  • Telecom Bus Bar (TGB)
  • Telecom Closet and Equipment Room

NATIONAL ELECTRICAL CODE

  • Article 250 Overview – Parts and Sections
  • Scope of Article 250
  • Organization of Article 250

SUBSTATION GROUNDING

  • Bonding of Fences and Other Metal Structures
  • Touch and Step Potential

TYPES OF SYSTEM GROUNDING

  • Solid and High Impedance Grounding
  • Grounded B Phase, Ground Detection

POWER QUALITY SITE SURVEY

  • Survey Objectives, Measurements, Inspection, Test
  • Equipment, Analysis

Attend This Class to See How To:

  • Comply with NEC Article 250
  • Understand Grounding and Bonding
  • Know the Grounding Electrode System Requirements
  • Select Main, System and Supply Side Bonding Jumpers
  • Understand Ground Loops and Power Quality
  • Bond Separately Derived Systems
  • Understand Substation Grounding and Step and Touch Potential

Questions?

For questions, registration information or to discuss holding this class at your location as an on-site training program

Brainfiller, Inc. | P.O. Box 12024 | Scottsdale, AZ 85267

800.874.8883​

480.725.7451

Program Director

Details

Start:
May 7, 2015 @ 8:00 am
End:
May 7, 2017 @ 5:00 pm