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Grounding, Bonding and Power Quality

Course No.: GP101
CEUs 0.8

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Overview

Arc Flash Training Jim PhillipsNational Electrical Code Article 250 can be one of the most confusing parts of the NEC.  This class teaches you the fundamentals of the grounding and bonding requirements based on the National Electrical for electrical power systems.  Learn about the grounding electrode system, equipment grounding, bonding jumpers and more.  Understand why substations have ground grids to minimize touch and step potential.  See what the requirements are for separately derived systems and how incorrect grounding can lead to ground loops which can create hazardous conditions.  Many power quality issues can be traced to incorrect grounding.  IEEE Standard 1100 defines requirements for grounding and bonding sensitive electronic equipment.  Power Quality is a broad term used to describe the health of a power system’s voltage and current. Spikes, sags, surges, noise and other events can disrupt the operation of critical systems. Many power quality problems can be attributed to improper or incorrect grounding.

In this, Jim shows you the correct grounding and bonding requirements to minimize or reduce power quality problems as well as how to identify and solve common power quality problems.

Jim has developed this course based on over 30 years of extensive experience in conducting numerous power quality studies for industrial, commercial and utility power systems.

[About Jim Phillips]


What You Will Receive

 Training manual and course material
 A better understanding of grounding and bonding requirements
 Access to Technical articles
Many in class examples and problems
 8 hours of Continuing Education Credit


Have This Class On-Site at Your Location

You can also have this class conducted on-site at your location.  Contact our Program Director at 800.874.8883 to see about having Jim teach this class to your staff at your company’s facilities.  Contact us for your custom on-site training proposal.


GROUNDING, BONDING AND POWER QUALITY – INTRODUCTION

GROUNDING AND ELECTRICAL SAFETY
Shock and Electrocution Current
Physiological Response to Electric Current
Importance of Grounding and Electrical Safety

BASIC CONCEPTS AND DEFINITIONS
Effective Ground Fault Current Path
Equipment Grounding Conductor
Separately Derived System
Ground Fault Circuit Interrupter
Grounding Electrode and Grounding Electrode Conductor

NATIONAL ELECTRICAL CODE
Article 250 Overview – Parts and Sections
Scope of Article 250
Organization of Article 250

GROUNDING AND BONDING REQUIREMENTS
Electrical System Grounding
Grounding of Electrical Equipment
Bonding of Electrical Equipment
Bonding of Electrically Conductive Material
Effective Ground Fault Current Path
Ungrounded System Grounding and Bonding Requirements

TYPES OF SYSTEM GROUNDING
Solid and High Impedance Grounding
Grounded B Phase, Ground Detection

BONDING JUMPER
NEC Table 250.102(C)(1)
Main Bonding Jumper
System Bonding Jumper
Supply Side Bonding Jumper
Correlation Between Bonding Jumper and Fault Current

GROUNDING ELECTRODE SYSTEM
Ground Rod, Metal Water Pipe, Building Steel
Concrete Encased Electrode, Ground Ring
Electrolytic Ground, Ground Resistance Requirements

GROUNDING ELECTRODE CONDUCTOR
NEC Table 250.66
Sizing the Grounding Electrode Conductor
Supplemental Electrode Requirements
Exceptions to NEC Table 250.66
Grounding Multiple Overhead Services
Example Problems

EQUIPMENT GROUNDING AND BONDING
Purpose of Equipment Grounding
NEC Table 250.122
Conductor Selection vs. Overcurrent Device Size
Conduit as the Equipment Ground

SEPARATELY DERIVED SYSTEMS
Service Entrance, Transformers, UPS, Generators and
3 pole vs. 4 pole transfer switches and Ground Loops,
Serving Two or More Buildings from One Source

GROUNDING TO EARTH
Ground Resistance, Soil Resistivity, Ground
Resistance Measurements, Grounding and Corrosion
Ground Grids, Touch and Step Potential

SUBSTATION GROUNDING
Bonding of Fences and Other Metal Structures
Touch and Step Potential

SENSITIVE ELECTRONIC EQUIPMENT GROUNDING
IEEE Std. 1100 Recommended Practice for Powering
and Grounding Electronic Equipment,
Signal Reference Subsystem, Equipontential Grounding,
Separation of Loads, Lighting/Surge Grounding
Isolated Ground Design, Shielded Transformers

TELECOMMUNICATION GROUNDING AND BONDING
Telecom Main Grounding Bus bar (TMGB)
Telecom Bonding Backbone (TBB)
Telecom Bus Bar (TGB)
Telecom Closet and Equipment Room

POWER QUALITY ANALYSIS
Definition of Power Quality, Wave Characteristics
Sags/Swells, Grounding and Objectionable Current
Noise, EMI, Ground Loops

POWER QUALITY SITE SURVEY
Survey Objectives, Measurements, Inspection, Test
Equipment, Analysis

POWER QUALITY CASE PROBLEMS AND SOLUTIONS


Attend This Class to See How To:Copy of Panel

 Comply with NEC Article 250
 Understand Grounding and Bonding
 Know the Grounding Electrode System Requirements
 Select Main, System and Supply Side Bonding Jumpers
 Understand Ground Loops and Power Quality
 Bond Separately Derived Systems
 Understand Substation Grounding and Step and Touch Potential


Questions?

Brain LogoFor questions, registration information or to discuss holding this class at your location as an on-site training program, contact our Program Director at 800.874.8883

Brainfiller, Inc. | P.O. Box 12024 | Scottsdale, AZ 85267